Suitable for a variety of demanding, precise, sensitive, non-destructive, clean and neat applications, with the characteristics of "cold processing" to solve ceramics, silicon, glass, sapphire, thin, brittle and rigid materials.

Suitable for a variety of demanding micro-precision, sensitive, non-destructive, clean and smooth applications, with the "cold processing" as the feature, to solve the ceramic, silicon, glass, sapphire, and other thin, brittle, hard materials.

Suitable for a variety of demanding micro-precision, sensitive, non-destructive, clean and smooth applications, with the "cold processing" as the feature, to solve the ceramic, silicon, glass, sapphire, and other thin, brittle, hard materials.

Suitable for a variety of demanding micro-precision, sensitive, non-destructive, clean and smooth applications, with the "cold processing" as the feature, to solve the ceramic, silicon, glass, sapphire, and other thin, brittle, hard materials.